MicroLink Technology

MicroLink Data Centers Technology dossier

MicroLink's Technology Development

Where we are developing intellectual property and first to market solutions.

Heat walks from the rack to the host

Every MicroLink deployment moves heat along the same path: the server loop through exchanger A, across the recovery loop to exchanger B, and into the host partner's process. The cooler on the return rail carries whatever the host partner does not take, hour by hour.

MicroLink: OnHost: On
L1 SERVER LOOP L3 HOST DELIVERY EXCH A EXCH B SERVER RACK COOLER DIGESTER 70 °C (158 °F) 35 °C (95 °F) 55 °C (131 °F) 10 °C (50 °F)

Who we are

MicroLink Data Centers builds high density, liquid cooled compute inside industrial host partner facilities: places that already hold the power and already buy the heat. Almost every watt a chip draws leaves the silicon as heat. Everyone else throws it away. We treat it as a second product.

Placeholder copy: founding, team, entity structure, footprint to date.

IMAGE PLACEHOLDER: deployment photo

What we do

We develop and operate compute across three scales on one shared stack: a 50 kW edge block, a 1.25 MW pod, and campuses from 10 MW up to 1 GW. No other company is developing a continuous range across these applications. Every scale runs the same software, the same thermal philosophy and the same dry cooler backed architecture, so what is proven at one scale carries to the next.

Edge
50 kW
Pod
1.25 MW
Campus
10 MW to 1 GW
Return water
40 to 65°C (104 to 149°F)

How we do it

We standardise the hardware and develop the layer above it. Cooling distribution, power modules and IT hardware are standardised with Vertiv and other leading manufacturers. MicroLink's own development, and its IP, sits in control, monitoring and management software, in system and solution design for compute inside industrial sites, in 800 V DC power, and in the systems that couple generation optimisation and heat recovery to compute. Delivered performance is reported as ERE alongside PUE, from live metering.

MICROLINK DEVELOPED Control, monitoring and management software System and solution design 800 V DC power Generation and heat STANDARDISED WITH PARTNERS Cooling plant Power modules IT hardware Vertiv and other leading manufacturers

Where we sit in the ecosystem

UPSTREAM

Manufacturers

Vertiv and other leading manufacturers supply standardised hardware against MicroLink reference designs.

ALONGSIDE

Host partners

Industrial facilities, district energy networks and utilities that hold power and buy delivered heat.

DOWNSTREAM

Compute offtake

Placeholder: colocation, cloud and AI capacity offtake across the three scales.

Team

Nick Searra

LinkedIn
CEO, Co Founder

Two decades of EMEA data center and power infrastructure development.

Shane Pather

LinkedIn
CTO

Controls engineer, commissioned Europe's largest heat recovery data centers.

Dane Harvey

LinkedIn
CFO

Thirteen years with GE, ending as Global Cash FP&A Leader in Boston.

Jamie Brown

LinkedIn
General Counsel

Data center and real estate counsel, Harvard Law, formerly Meta and Fifth Space.

Carla Trippe

LinkedIn
Head of Operations and Impact

Fourteen years of impact and operations, USAID, Gates Foundation, United Nations.

Andrew Thomas

LinkedIn
Chief Commercial Officer

Energy storage executive, co founder and president of Acculon Energy, Ohio.

Jeff Svedahl

LinkedIn
CEO, MicroLink Edge

Twenty five years of global procurement for Choice Hotels, Radisson and Target.

Heath Andersen

LinkedIn
Data Center Design Advisor

Twenty five years of data center design across Australia, the UK and the Middle East.

Sancha Olivier

LinkedIn
Strategic Advisor

Data center architect and senior project manager, mission critical data center design.

David Hassler

LinkedIn
Head of Sales and Customer

Twenty five years in capacity planning, seventeen at Akamai, now at Vultr.

Deniz Akgul

LinkedIn
Capital and Investment Advisor

Structured finance advisor, Houlihan Lokey and Brevan Howard, founder of White Rose Capital.

DRAFT. LinkedIn URLs to be supplied per person.

Submitted IP

Placeholder summary of intellectual property already submitted, with the pipeline of candidate families behind it. IP is held in a dedicated IP holding entity within the group structure.

ReferenceAreaScopeStatus
IP 01Heat reuseMetered heat delivery interfaceSubmitted, placeholder
IP 02OptimisationCo dispatch of compute, generation and heatSubmitted, placeholder
IP 03Generation800 V DC distribution and protectionIn preparation, placeholder

DRAFT. References, scopes and statuses are placeholders pending counsel review. Nothing on this page is a representation of filed rights.

Solutions: the technologies under development in heat reuse, optimisation and generation. Projects: where each technology is being proven. Reference: partners, technologies and research.

Solutions Technology under development

Three families, one stack

Every solution below is being developed across the full range, from the 50 kW edge block to the 1 GW campus. Open any block for what it is, what is new, and where the IP sits.

Heat reuse

HR 01

Metered heat delivery interface

One metered exchanger between MicroLink plant and the host partner's systems: process hot water, digesters, district heat, greenhouses. The commercial and physical boundary in a single engineered product.

Solution detail
HR 02

High grade return water systems

Direct to chip liquid cooling engineered from the first decision for recovery, returning water at 40 to 65°C (104 to 149°F) matched to real industrial demand.

Solution detail
HR 03

Thermal demand matching and storage

Buffering and demand matching between a constant compute heat source and a variable industrial heat user, so compute never waits on thermal demand.

Solution detail

Optimisation

OP 01

Edge Gateway

Placeholder description. On site control, safety interlocks and telemetry at block and pod level. The layer that makes unstaffed operation of a 50 kW site possible.

Solution detail
OP 02

Mesh AI

Placeholder description. Site level co optimisation of compute load, cooling, heat delivery and the dry cooler path, hour by hour.

Solution detail
OP 03

Node Intelligence

Placeholder description. Fleet analytics: cross fleet learning, predictive maintenance and benchmarking across every MicroLink deployment.

Solution detail
OP 04

MCS platform

Placeholder description. The management and control platform tying the suite together: operations, host partner reporting, ERE and PUE accounting, commercial metering.

Solution detail

Generation

GN 01

800 V DC distribution

Direct current from generation and storage to the rack. Conversion stages removed, copper cut, and the architecture the next accelerator generation will demand.

Solution detail
GN 02

Generation and storage coupling

On site generation and storage dispatched against compute load and heat demand as one problem, under one control scheme.

Solution detail
GN 03

Grid aware operation

Placeholder description. Curtailment capture, demand response and constrained grid operation, so compute lands in markets where new utility load waits years.

Solution detail

HR 01 Solution detail

Metered heat delivery interface

One metered exchanger between MicroLink plant and the host partner's systems: process hot water, digesters, district heat, greenhouses. The commercial and physical boundary in a single engineered product.

What is new here

  • A standard, meterable boundary product for delivered heat where the industry has ad hoc engineering
  • Heat accounting built for ERE reporting alongside PUE from live metering
GRAPHIC PLACEHOLDER: Metered heat delivery interface concept diagram, supply and return colour coding, dry cooler path where relevant

Fig HR 01.1 Draft

IMAGE PLACEHOLDER: Metered heat delivery interface hardware or interface

Fig HR 01.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for metered heat delivery interface. Summary on the overview.

All solutions

HR 02 Solution detail

High grade return water systems

Direct to chip liquid cooling engineered from the first decision for recovery, returning water at 40 to 65°C (104 to 149°F) matched to real industrial demand.

What is new here

  • Cooling designed backwards from the heat user's temperature requirement, not forwards from the chip
  • Dry coolers sized for the full load carry whatever the host partner does not take, hour by hour
GRAPHIC PLACEHOLDER: High grade return water systems concept diagram, supply and return colour coding, dry cooler path where relevant

Fig HR 02.1 Draft

IMAGE PLACEHOLDER: High grade return water systems hardware or interface

Fig HR 02.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for high grade return water systems. Summary on the overview.

All solutions

HR 03 Solution detail

Thermal demand matching and storage

Buffering and demand matching between a constant compute heat source and a variable industrial heat user, so compute never waits on thermal demand.

What is new here

  • Placeholder: storage sizing method, demand forecasting for industrial thermal loads
  • Placeholder: integration kits per host partner industry
GRAPHIC PLACEHOLDER: Thermal demand matching and storage concept diagram, supply and return colour coding, dry cooler path where relevant

Fig HR 03.1 Draft

IMAGE PLACEHOLDER: Thermal demand matching and storage hardware or interface

Fig HR 03.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for thermal demand matching and storage. Summary on the overview.

All solutions

OP 01 Solution detail

Edge Gateway

Placeholder description. On site control, safety interlocks and telemetry at block and pod level. The layer that makes unstaffed operation of a 50 kW site possible.

What is new here

  • Lights out operation at the smallest useful scale, driven by software rather than site staff
  • Same telemetry model from 50 kW to 1 GW
GRAPHIC PLACEHOLDER: Edge Gateway concept diagram, supply and return colour coding, dry cooler path where relevant

Fig OP 01.1 Draft

IMAGE PLACEHOLDER: Edge Gateway hardware or interface

Fig OP 01.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for edge gateway. Summary on the overview.

All solutions

OP 02 Solution detail

Mesh AI

Placeholder description. Site level co optimisation of compute load, cooling, heat delivery and the dry cooler path, hour by hour.

What is new here

  • Heat delivery to the host partner as a first class control objective alongside uptime
  • Placeholder: optimisation scope and method
GRAPHIC PLACEHOLDER: Mesh AI concept diagram, supply and return colour coding, dry cooler path where relevant

Fig OP 02.1 Draft

IMAGE PLACEHOLDER: Mesh AI hardware or interface

Fig OP 02.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for mesh ai. Summary on the overview.

All solutions

OP 03 Solution detail

Node Intelligence

Placeholder description. Fleet analytics: cross fleet learning, predictive maintenance and benchmarking across every MicroLink deployment.

What is new here

  • A telemetry and data model that turns every site into training data for the next
  • Placeholder: analytics scope
GRAPHIC PLACEHOLDER: Node Intelligence concept diagram, supply and return colour coding, dry cooler path where relevant

Fig OP 03.1 Draft

IMAGE PLACEHOLDER: Node Intelligence hardware or interface

Fig OP 03.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for node intelligence. Summary on the overview.

All solutions

OP 04 Solution detail

MCS platform

Placeholder description. The management and control platform tying the suite together: operations, host partner reporting, ERE and PUE accounting, commercial metering.

What is new here

  • ERE reported alongside PUE as a live operational metric at every site
  • Placeholder: platform scope
GRAPHIC PLACEHOLDER: MCS platform concept diagram, supply and return colour coding, dry cooler path where relevant

Fig OP 04.1 Draft

IMAGE PLACEHOLDER: MCS platform hardware or interface

Fig OP 04.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for mcs platform. Summary on the overview.

All solutions

GN 01 Solution detail

800 V DC distribution

Direct current from generation and storage to the rack. Conversion stages removed, copper cut, and the architecture the next accelerator generation will demand.

What is new here

  • An 800 V DC bus designed as native distribution for a containerised pod, not a lab demonstration
  • Protection and safety philosophy for high voltage DC inside industrial host partner facilities
GRAPHIC PLACEHOLDER: 800 V DC distribution concept diagram, supply and return colour coding, dry cooler path where relevant

Fig GN 01.1 Draft

IMAGE PLACEHOLDER: 800 V DC distribution hardware or interface

Fig GN 01.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for 800 v dc distribution. Summary on the overview.

All solutions

GN 02 Solution detail

Generation and storage coupling

On site generation and storage dispatched against compute load and heat demand as one problem, under one control scheme.

What is new here

  • Nobody dispatches compute, generation and recovered heat together. That co optimisation is the programme
  • Placeholder: asset classes in scope, waste to energy, gas, solar, storage
GRAPHIC PLACEHOLDER: Generation and storage coupling concept diagram, supply and return colour coding, dry cooler path where relevant

Fig GN 02.1 Draft

IMAGE PLACEHOLDER: Generation and storage coupling hardware or interface

Fig GN 02.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for generation and storage coupling. Summary on the overview.

All solutions

GN 03 Solution detail

Grid aware operation

Placeholder description. Curtailment capture, demand response and constrained grid operation, so compute lands in markets where new utility load waits years.

What is new here

  • Placeholder: grid services scope
  • Placeholder: interconnection strategy method
GRAPHIC PLACEHOLDER: Grid aware operation concept diagram, supply and return colour coding, dry cooler path where relevant

Fig GN 03.1 Draft

IMAGE PLACEHOLDER: Grid aware operation hardware or interface

Fig GN 03.2 Draft

IP position

Placeholder. Candidate protection route, related filings and trade secret scope for grid aware operation. Summary on the overview.

All solutions

Projects Where the technology is proven

Development projects

Twelve sites across the portfolio, each carrying a defined set of the technologies from the solutions register. Codes below map to the blocks on the solutions page.

Franklin Twp, Richland Co, OH

Mansfield

250+ MW IT · Owned

Technologies in view: HR 01 · OP 02 · OP 04 · GN 01 · GN 02

Arizona

Gigawatt Land

250+ MW IT · Owned

Technologies in view: GN 01 · GN 02 · GN 03 · OP 04

Pennsylvania

Fort Cherry District

250+ MW IT · Owned

Technologies in view: GN 01 · GN 02 · OP 02 · OP 04

Northampton County, PA

Bethlehem

8 MW IT · Owned

Technologies in view: HR 01 · HR 02 · OP 01 · OP 02

Massena, NY

Massena St Lawrence

250+ MW IT · Owned

Technologies in view: GN 02 · GN 03 · OP 02 · OP 04

Chicago, IL

Stickney MWRD

45 MW IT · Host

Technologies in view: HR 01 · HR 02 · HR 03 · OP 02

New York

NYSERDA pilot

45 MW IT · Host

Technologies in view: HR 01 · HR 02 · OP 02 · GN 03

Japan

Undisclosed

45 MW IT · Host

Technologies in view: HR 01 · HR 02 · OP 02

Philadelphia, PA

Grays Ferry

25 MW IT · Host

Technologies in view: HR 01 · HR 02 · HR 03 · GN 03

New York, NY

Newtown Creek

15 MW IT · Host

Technologies in view: HR 01 · HR 02 · OP 01 · OP 02

San Jose, CA

San Jose

15 MW IT · Host

Technologies in view: HR 01 · HR 02 · OP 01

New Jersey

Princeton

4 MW IT · Host

Technologies in view: HR 01 · HR 02 · OP 01

DRAFT. Technology mappings per site are placeholders for internal review. Confirm what is disclosed to funds before circulation.

Reference Partners, technologies, research

What we build on

The manufacturers we standardise with, the technologies we work with, and the research behind the programme.

Partners

MANUFACTURING

Vertiv

Cooling distribution, CDUs, dry coolers and power modules standardised against MicroLink reference designs. Placeholder detail.

MANUFACTURING

Leading manufacturers

Placeholder blocks for additional named manufacturing and component partners.

HOST PARTNERS

Industrial and district energy

Placeholder: the host partner categories and named partners cleared for disclosure.

GRAPHIC PLACEHOLDER: partner logo band, pending permissions

Technologies we work with

  • Direct to chip liquid cooling, returning water at 40 to 65°C (104 to 149°F)
  • Dry coolers sized for the full load, carrying whatever the host partner does not take
  • Coolant distribution units and secondary loop plant from leading manufacturers
  • 800 V DC power conversion and protection components
  • On site generation and storage: placeholder asset classes
  • Placeholder: accelerator and IT platform references

Research to date

ReferenceTopicWithStatus
R1Heat recovery performance, placeholder topicUniversity research collaborationPlaceholder
R2Co dispatch of compute, generation and heatInternalPlaceholder
R3800 V DC distribution studyPlaceholder partnerPlaceholder

DRAFT. Add published papers, white papers, bases of design and field data references here.